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Will feature rigid and flexible packaging solutions at Interpack.
April 28, 2017
By: DAVID SAVASTANO
Coveris will showcase a variety of innovative packaging solutions at Interpack, Düsseldorf, Germany from May 4-10. “Interpack is an opportunity for us to connect with potential and existing customers and showcase the forward looking innovative ideas we are developing every day,” said Dave Mezzanotte, CEO and chairman of Coveris. Coveris will feature rigid and flexible packaging solutions at Interpack, including Envio forming films, Nextrus next generation vacuum shrink bags, functional and highly decorative DuoSmart cups, Grab Box food-to-go packaging and thermoformed in-mold labeled (TIML) containers. Many of the products on display represent innovations that are the first of their kind and are a reflection of Coveris’ investment in modernizing its facilities with new technologies to continue manufacturing packaging solutions that give customers an edge in the marketplace. The company will also showcase the other recent investments it has made in technology, such as a 3D printing system, which can be used to print precise rapid prototypes of rigid packaging designs.
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